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| FET Chip Mounting Capacitors (MIS) SC9016-000, SC9017-000 Features High Reliability Low Loss Operation Through 26 GHz Wide Temperature Operation Description The FET Chip Mounting Capacitor is an MIS thin film device which features small size and very high Q making it ideal for hybrid microelectronic applications at microwave frequencies. The device has a dielectric composed of thermally grown silicon dioxide over which a layer of silicon nitride is deposited. This dielectric possesses a low temperature coefficient of capacitance, very high insulation resistance (typically greater than 1012 ohms), and low dissipation factor. The device also exhibits excellent long term stability making it suitable for high reliability applications. The capacitor has a high dielectric breakdown which permits the use of thin dielectrics resulting in large capacitance in a small area. The plated gold metalization on the top face of the chip extends over most of the top surface. Gold wire can be readily thermocompression bonded to this metalization. The back side of the chip is also gold metallized and is readily solderable. Custom parts can be made having special values of capacitance or working voltage. Special metallization geometries or chip sizes can also be made available upon request. Maximum Ratings Operating Temperature (TOP): Storage Temperature (TSTG): Dielectric Withstanding Voltage: -65 to + 200C -65 to +200C 50 Volts 5 Electrical Specifications Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . 100 pF Temperature Coefficient . . . . . . . . . . . . . . . . . . 50 ppm/C Capacitance Tolerance . . . . . . . . . . . . . . . . . . . . . . . . 20% Thermal Resistance SC9016 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10C/W SC9017 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12C/W For Alumina Substrate Thickness 0.015 0.025 Part Number SC9016-000 SC9017-000 Outline Drawing Number 411-801 411-802 Thickness 0.010 0.020 For FET Chip Thickness 0.005 0.005 Alpha Industries * [617] 935 5150 * Fax [617] 824 4579 * E-mail sales@alphaind.com * Visit our web site: www.alphaind.com 5-9 FET Chip Mounting Capacitors (MIS) SC9016-000, SC9017-000 The capacitor is designed to serve as a carrier for FET amplifier chips. As shown in Figure 1, when the FET chip is mounted directly onto the top metal pad of the capacitor, the gate and drain pads are on the same level as the top of the alumina circuit. Therefore, short wire lengths can be used to minimize the lead inductance. The SC9016 is a 10 mil thick chip designed for 15 mil thick alumina, while the SC9017 is a 20 mil thick chip designed for 26 mil thick alumina. When the FET chips is mounted directly onto the top metal pad of the capacitor, the source pads on the FET chip can be wire bonded to the same metal pads, which accomplishes RF bypass to ground via the capacitor. TOP VIEW Alumina (0.015 or 0.025") Source Wires FET Chip Drain Gate Source FET Chip Mounting Capacitor Figure 2. Schematic Diagram Outline Dimensions Gate Circuit Drain Circuit 411-801 FET Chip Mounting Capacitor Source Wires SIDE VIEW 0.010 or 0.020" 0.015 or 0.025" Figure 1. FET Chip Mounted on Top Metal Pad of Capacitor 5-10 Alpha Industries * [617] 935 5150 * Fax [617] 824 4579 * E-mail sales@alphaind.com * Visit our web site: www.alphaind.com EEEE EEEEE 411-802 |
Price & Availability of SC9016-000
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